Technology Competitiveness and Industrial Policy Center Announces Policy Study Awards
Berkeley, Calif., July 29, 2025 – The Technology Competitiveness and Industrial Policy Center (TCIP.org), a newly established academic research center at the University of California, Berkeley, has announced the recipients of its first policy study awards. Launched this spring, the TCIP Center aims to address challenges facing U.S. competitiveness in advanced technology research, development, and domestic advanced manufacturing.
The Center’s inaugural call for policy study proposals, issued in March 2025, attracted submissions from interdisciplinary teams of industry leaders and academic researchers. Awardees include experts from prestigious institutions such as the Massachusetts Institute of Technology, Stanford University, Carnegie Mellon University, and the University of California, Berkeley.
Fostering U.S. Leadership in Advanced Technologies
Mark Liu, TCIP founder and former executive chairman of Taiwan Semiconductor Manufacturing Company (TSMC), the world’s largest semiconductor manufacturer, emphasized the strategic importance of the Center’s mission. “The U.S. may lead the world in many parts of the value chain of advanced technology,” Liu said, “yet it lags behind other countries in the production of these advanced technologies.”
The TCIP Center looks to these funded studies to provide actionable insights and policy roadmaps that will bolster the United States’ ability to scale and deploy cutting-edge technologies critical for economic and national security.
S. Shankar Sastry, TCIP Faculty Director and professor of electrical engineering and computer sciences at UC Berkeley, commented: “These proposals will put us on the path to increased competitiveness, envisioning the hyperstructure needed to scale and deploy emerging technologies.”
Awarded Policy Studies
The selected studies address key sectors vital to U.S. technological leadership and manufacturing strength:
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Scaling Wide-Bandgap Technologies for Energy, Transportation, and Digital Infrastructure
Led by Saurabh Amin of MIT, this study analyzes causal and policy factors influencing U.S. competitiveness in wide-bandgap (WBG) semiconductor technologies. It focuses on scaling production to meet surging demand in energy systems, transportation, and digital infrastructure. -
Strategic Pathways for Next-Generation Nuclear Deployment
Per Petersen of UC Berkeley explores barriers and opportunities related to the deployment of next-generation nuclear energy technologies, including small modular reactors (SMRs) and advanced reactors aimed at safe, scalable, and low-carbon power generation. -
Governing the Future of Nuclear Fusion
Led by Andrew Reddie of UC Berkeley, this project aims to develop frameworks that support the transition of recent breakthroughs in fusion energy from research to commercial viability. -
Semiconductor Manufacturing Ecosystems
Stanford’s H.-S. Phillip Wong spearheads a study taking a comprehensive ecosystem-wide approach to identify success models for semiconductor research, development, and manufacturing. -
Global Shift Toward EVs and Challenges to American Competitiveness
John Zysman from UC Berkeley examines the worldwide transition to electric vehicles, the ensuing challenges to U.S. competitiveness in the sector, and the necessary conditions to build a vibrant American EV industry.
These recently announced studies build on the TCIP Center’s inaugural policy investigation on Technology Leadership in Rechargeable Electrochemical Batteries released in April 2025. About the Technology Competitiveness and Industrial Policy Center
Founded in February 2025 by Mark Liu, the TCIP Center is dedicated to forging a visionary approach to advanced technology development and manufacturing in the United States. It merges academic research with industrial expertise and regulatory policy analysis to support the growth of domestic capabilities in critical technology sectors.
For more information, visit TCIP.org or follow @TCIPcenter on social media.
Media Contact:
Kap Stann
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Phone: 510-295-9685
Source: Business Wire